Features:
1.SMD type zinc oxide based ceramic chip
2.Lead free plating termination provided good solderability characteristic
3.Insulator overcoat keeps excellent low and stable leakage current
4.Quick response time (<1ns)
5.Low clamping voltage
6.High transient current capability
7.Meet IEC 61000-4-2, 61000-4-4, and 61000-4-5 standard
Application:
Applications for Mother Board, Notebook, Cellular Phone, PDA, handheld device,
DSC, DV, Scanner, and Set-Top Box…etc.